Electrical and mechanical studies of MCM-D interconnect structure

Abstract

The electrical and mechanical properties of a multilayer thin-film MCM-D interconnect are studied in this investigation. Numerical analyses are executed to calculate the electrical parameters of thin-film microstrip line and it shows that the additional delay decreases while increasing the thickness of the conductor. Environmental scanning electron microscopy (E-SEM) was utilized to characterize mechanical induced defects in signal line. Cracking on metal lines and delamination of polyimide/metal interfaces due to mismatch of coefficient of thermal expansion and the moisture absorption of the polyimide film were observed.