{"title":"Integration of free SPICE Simulator into the Cadence Environment","authors":"A. Serhan, V. Velayudhan, Vladcostel Aniculaesei","doi":"10.1109/MELCON.2014.6820577","DOIUrl":null,"url":null,"abstract":"This paper presents a graphical interface allowing the integration of free SPICE simulator into the Cadence Design Environment which is commonly used for integrated circuits Design. The developed interface is based on the SKILL language and does not require additional license. The capability of the developed interface to perform multiple simulation set-up, component parameterization, output results plotting, and technology files configuration are discussed and exemplified for the free ngspice simulator developed by Berkley University and using AMS 0.35μm technology.","PeriodicalId":103316,"journal":{"name":"MELECON 2014 - 2014 17th IEEE Mediterranean Electrotechnical Conference","volume":"351 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-04-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"MELECON 2014 - 2014 17th IEEE Mediterranean Electrotechnical Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MELCON.2014.6820577","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
This paper presents a graphical interface allowing the integration of free SPICE simulator into the Cadence Design Environment which is commonly used for integrated circuits Design. The developed interface is based on the SKILL language and does not require additional license. The capability of the developed interface to perform multiple simulation set-up, component parameterization, output results plotting, and technology files configuration are discussed and exemplified for the free ngspice simulator developed by Berkley University and using AMS 0.35μm technology.