Mechanical bend fatigue reliability of lead-free PBGA assemblies

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI:10.1109/ITHERM.2002.1012553

K. Jonnalagadda, M. Patel, A. Skipor

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引用次数: 8

Abstract

In recent years, proposed legislative action and the product differentiation opportunities presented by environmentally friendly products have combined to significantly increase the development of lead-free solder materials. A few lead-reduced products are already in production and several lead-free products will be released in the next two years. Among the various lead-free solders, the SnAgCu family of solders has emerged as one of the leading candidates for high volume implementation. This paper examines the mechanical fatigue reliability of SnAgCu PBGAs on FR4 boards. While a fairly extensive reliability database is available for BGAs built with tin-lead solders, similar data is not available for BGAs assembled with lead-free solder. Mechanical bend fatigue reliability is a critical indicator for phone and BGA survival during repeated keypress, and to some extent, during drop. The lead-free reliability data is compared to that from control samples built with tin-lead solders, both in low-cycle and high-cycle fatigue. Failure analysis was conducted to identify failure modes.

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无铅PBGA组件的机械弯曲疲劳可靠性

近年来，拟议的立法行动和环保产品所带来的产品差异化机会相结合，大大增加了无铅焊料材料的发展。一些减少铅的产品已经投入生产，未来两年内将推出几款无铅产品。在各种无铅焊料中，SnAgCu系列焊料已成为大批量实现的主要候选产品之一。本文研究了FR4板上SnAgCu PBGAs的机械疲劳可靠性。虽然对于使用锡铅焊料构建的bga有相当广泛的可靠性数据库，但对于使用无铅焊料组装的bga没有类似的数据。机械弯曲疲劳可靠性是手机和BGA在重复按键过程中存活的关键指标，在某种程度上，在跌落过程中也是如此。在低周和高周疲劳状态下，将无铅可靠性数据与用锡铅焊料制成的对照样品进行了比较。进行失效分析，识别失效模式。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)

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