{"title":"Challenges and trade-offs of SOC vs SIP - Session 5","authors":"Rakesh H. Patel","doi":"10.1109/cicc.2004.1358735","DOIUrl":null,"url":null,"abstract":"The process technology innovation and integration continues, allowing the realization of complex System-onChip (SoC) integrating on the same chip tens of millions of transistors performing different functionality. In addition, to achieving an integrated system, SoC may not always be the most feasible solution, where the cost and complexity will increase, in comparison to System-In-Chip (Sip) solution. This session will also cover a more cost effective embedded memory solution (MRAM); as well as discuss the GSP SoC solution where the digital, analog and RF functionality have been embedded in a single chip.","PeriodicalId":407909,"journal":{"name":"Proceedings of the IEEE 2004 Custom Integrated Circuits Conference (IEEE Cat. No.04CH37571)","volume":"52 6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the IEEE 2004 Custom Integrated Circuits Conference (IEEE Cat. No.04CH37571)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/cicc.2004.1358735","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The process technology innovation and integration continues, allowing the realization of complex System-onChip (SoC) integrating on the same chip tens of millions of transistors performing different functionality. In addition, to achieving an integrated system, SoC may not always be the most feasible solution, where the cost and complexity will increase, in comparison to System-In-Chip (Sip) solution. This session will also cover a more cost effective embedded memory solution (MRAM); as well as discuss the GSP SoC solution where the digital, analog and RF functionality have been embedded in a single chip.