Challenges and trade-offs of SOC vs SIP - Session 5

Rakesh H. Patel
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Abstract

The process technology innovation and integration continues, allowing the realization of complex System-onChip (SoC) integrating on the same chip tens of millions of transistors performing different functionality. In addition, to achieving an integrated system, SoC may not always be the most feasible solution, where the cost and complexity will increase, in comparison to System-In-Chip (Sip) solution. This session will also cover a more cost effective embedded memory solution (MRAM); as well as discuss the GSP SoC solution where the digital, analog and RF functionality have been embedded in a single chip.
SOC与SIP的挑战和权衡-第5部分
工艺技术的创新和集成仍在继续,使得在同一芯片上集成数千万个执行不同功能的晶体管的复杂系统芯片(SoC)得以实现。此外,为了实现集成系统,SoC可能并不总是最可行的解决方案,与片内系统(Sip)解决方案相比,SoC的成本和复杂性会增加。本次会议还将讨论更具成本效益的嵌入式内存解决方案(MRAM);并讨论了将数字、模拟和射频功能嵌入到单个芯片中的GSP SoC解决方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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