Y. Zheng, Po-Ping Kan, Liang-Bi Chen, Kai-Yang Hsieh, Bo-Chuan Cheng, Katherine Shu-Min Li
{"title":"Fault tolerant application-specific NoC topology synthesis for three-dimensional integrated circuits","authors":"Y. Zheng, Po-Ping Kan, Liang-Bi Chen, Kai-Yang Hsieh, Bo-Chuan Cheng, Katherine Shu-Min Li","doi":"10.1109/SOCC.2011.6085088","DOIUrl":null,"url":null,"abstract":"This paper proposes a synthesis methodology for constructing Application-Specific NoCs topology in 3D chips. The multi-cores and communications can be synthesized simultaneously in the system-level floorplanning process with fault tolerant consideration. As a result, the experimental results show that the proposed approach produces 3D NoCs with lower power dissipation than previous works in multimedia applications with relatively small overhead of the number of Through-Silicon-Vias (TSVs) for achieving 100% fault tolerance in 3D NoC links based on single fault assumption.","PeriodicalId":365422,"journal":{"name":"2011 IEEE International SOC Conference","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2011-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 IEEE International SOC Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SOCC.2011.6085088","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
This paper proposes a synthesis methodology for constructing Application-Specific NoCs topology in 3D chips. The multi-cores and communications can be synthesized simultaneously in the system-level floorplanning process with fault tolerant consideration. As a result, the experimental results show that the proposed approach produces 3D NoCs with lower power dissipation than previous works in multimedia applications with relatively small overhead of the number of Through-Silicon-Vias (TSVs) for achieving 100% fault tolerance in 3D NoC links based on single fault assumption.