Monolithically patterned high mobility solution-processed metal-oxide TFTs with metallic capping layers

Kyung‐Tae Kim, Jae Hyun Kim, I. Jang, Chanho Jo, Jaekyun Kim, Yong‐Hoon Kim, S. Park
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Abstract

Amorphous indium gallium zinc oxide(IGZO) based thin film transistors(TFTs) have been widely studied due to their good electrical properties such as optical transparent and field effect mobility. The demand for low-cost process of thin film devices has needed solution processed metal oxide TFTs. Although many effective ways of fabricating soluble metal oxide TFTs have been investigated1, there is still the necessity of increasing field effect mobility of TFTs. As a one way of mobility improvement, low work function metals(Ca, Ti) were used as passivation in terms of capping layer on top of the IGZO active layer2,3. The metal capping method has obvious several advantages, but we expect the additional process cost due to a step of patterning the capping layer. Also, because nature of metals has no transparent characteristics, this pure metal capping method could not available in transparent applications. In this paper, we suggest a real time deposition method of electrodes and capping layer for solution processed IGZO TFTs with maintaining transparency and process cost.
具有金属盖层的单片高迁移率溶液加工金属氧化物tft
基于非晶铟镓锌氧化物(IGZO)的薄膜晶体管(TFTs)由于具有良好的光学透明性和场效应迁移率等电性能而受到广泛的研究。对薄膜器件低成本工艺的需求要求解决金属氧化物薄膜晶体管的问题。虽然已经研究了许多制备可溶性金属氧化物tft的有效方法1,但仍然需要提高tft的场效应迁移率。作为提高迁移率的一种方法,低功功能金属(Ca, Ti)在IGZO有源层的顶部作为钝化封盖层2,3。金属盖层方法有几个明显的优点,但我们期望额外的工艺成本,由于一个步骤的图案盖层。另外,由于金属本身不具有透明的特性,这种纯金属封盖方法也不能用于透明应用。在本文中,我们提出了一种实时沉积电极和盖层的方法,用于溶液加工的IGZO tft,同时保持透明度和工艺成本。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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