Material and device issues of InAlN/GaN heterostructures

J. Kuzmík
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引用次数: 6

Abstract

Motivation for replacing the AlGaN barrier layer of the conventional AlGaN/GaN HEMTs with lattice-matched InAlN is explained. State-of-the-art InAlN/GaN HEMTs are reviewed; emphasize is given to the analysis of the normally-off InAlN/GaN HEMTs using either a gate recessing or a concept of polarization engineering. Reliability issues of InAlN/GaN HEMTs are studied for different stress conditions and results discussed in respect to AlGaN/GaN HEMTs. Concept of InAlN/GaN/AlGaN double-heterostructure QW HEMT is shown to be more effective in blocking the hot electron injection in to the buffer. Novel InN-channel based devices are suggested with a relaxed InAlN buffer. The InN/InAlN-based HEMTs should be the choice for reaching a THz frequency range.
InAlN/GaN异质结构的材料和器件问题
解释了用晶格匹配的InAlN取代传统AlGaN/GaN hemt的AlGaN势垒层的动机。回顾了最新的InAlN/GaN hemt;重点分析了正常关断的氮化铟/氮化镓hemt,采用栅极凹陷或极化工程的概念。研究了不同应力条件下InAlN/GaN hemt的可靠性问题,并讨论了AlGaN/GaN hemt的结果。InAlN/GaN/AlGaN双异质结构QW HEMT的概念可以更有效地阻止热电子注入到缓冲液中。提出了一种新颖的基于inn通道的器件,具有宽松的InAlN缓冲。基于InN/ inaln的hemt应该是达到太赫兹频率范围的选择。
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