{"title":"4 Gbps On-Chip Interconnection using Differential Transmission Line","authors":"H. Ito, H. Sugita, K. Okada, K. Masu","doi":"10.1109/ASSCC.2005.251754","DOIUrl":null,"url":null,"abstract":"This paper demonstrates the differential transmission line interconnect for high-speed global interconnect IP. The interconnect is fabricated using a 180 nm CMOS technology. 4 Gbps signal transmission can be achieved in measurement results. The on-chip transmission line performs faster signal transmission than common RC interconnects","PeriodicalId":341932,"journal":{"name":"2005 IEEE Asian Solid-State Circuits Conference","volume":"191 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"17","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 IEEE Asian Solid-State Circuits Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASSCC.2005.251754","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 17
Abstract
This paper demonstrates the differential transmission line interconnect for high-speed global interconnect IP. The interconnect is fabricated using a 180 nm CMOS technology. 4 Gbps signal transmission can be achieved in measurement results. The on-chip transmission line performs faster signal transmission than common RC interconnects