{"title":"Analog design trends in communication systems","authors":"J. Hauptmann, Dario Giotta, Ulrich Gaier","doi":"10.1109/PRIME.2013.6603137","DOIUrl":null,"url":null,"abstract":"Modern high-speed silicon technologies in the submicron region enable today very efficient and cost effective digital communication systems. Highly integrated system-on-chip (SoC) solutions cover satisfying the ever-increasing demand for broadband communication from home. High data transfer rates with excellent quality are achieved through the use of Wi-Fi, DSL, Ethernet and optical transport. The presentation will deal with the most important design aspects and system trends that occur in the development of RF- and MS-front-end modules for SoC integration. New trends in wireless, as well as requirements for individual MS/RF blocks are considered with respect to high integration and cost reduction.","PeriodicalId":125553,"journal":{"name":"Proceedings of the 2013 9th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-06-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 2013 9th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/PRIME.2013.6603137","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Modern high-speed silicon technologies in the submicron region enable today very efficient and cost effective digital communication systems. Highly integrated system-on-chip (SoC) solutions cover satisfying the ever-increasing demand for broadband communication from home. High data transfer rates with excellent quality are achieved through the use of Wi-Fi, DSL, Ethernet and optical transport. The presentation will deal with the most important design aspects and system trends that occur in the development of RF- and MS-front-end modules for SoC integration. New trends in wireless, as well as requirements for individual MS/RF blocks are considered with respect to high integration and cost reduction.