Improved LDMOS for ESD Protection of High Voltage BCD Process

Shen Hong-yu, Dong Shu-rong, XU Ze-kun, HU Tao, Guo-Chih Wei, Huang Wei
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引用次数: 3

Abstract

LDMOS is widely used as an ESD protection device. In high voltage BCD technology. However, due to the use of low concentration medium voltage well in HV process, the LDMOS is easily damaged by the Kirk effect under ESD stress, and the robustness is very low. A novel LDMOS is proposed in this work by using a high concentration well to surround the drain intraditional LDMOS, which, achieves a high ESD robustness with a current level of 0.76A,and the Ron is reduced from the original 25Ω to 6.25Ω. In other hand ,in order to save the area, the conventional LDMOS-SCR has been improved by the drain terminal segment, which make the improved LDMOS-SCR maintain a high robustness while the device area is smaller than that of the conventional LDMOS-SCR, thereby improving the area efficiency.
用于高压BCD工艺ESD保护的改进LDMOS
LDMOS作为一种ESD保护器件得到了广泛的应用。在高压BCD技术。然而,由于在高压工艺中使用低浓度的中压,LDMOS在ESD应力下容易受到Kirk效应的破坏,鲁棒性很低。本研究提出了一种新型LDMOS,通过在传统LDMOS的漏极周围使用高浓度井,实现了高ESD稳健性,电流水平为0.76A,并且Ron从原来的25Ω降低到6.25Ω。另一方面,为了节省面积,对传统的LDMOS-SCR进行了漏极端段的改进,使得改进后的LDMOS-SCR在器件面积小于传统LDMOS-SCR的同时保持了较高的鲁棒性,从而提高了面积效率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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