Soft Defect Localization (SDL) of Temperature Dependent Failure using NI-PXI Test Platform in DALS System

Abstract

Temperature dependent failures have always presented challenges in failure analysis of advanced mixed signal integrated circuits. Soft defect localization (SDL) has been proven a reliable fault isolation technique however, reliable capture of pass/fail signal conditions, temperature characterization and laser synchronization are vital in having an effective SDL result. This paper presents a case study which demonstrates how NI-PXI system was utilized as a test and synchronization platform with DALS module of Hamamatsu iPHEMOS.