Design, characterization and signal integrity analysis of a 2.5 Gb/s High-Speed Serial Interface for automotive applications overarching the chip/PCB wall

Abstract

A 2.5 Gb/s high-speed serial transmitter for automotive applications has been designed and a circuit/package/board integrated simulation procedure has been set up, enabling the co-design of High-Speed-Serial Interfaces. This simulation methodology employs transistor level models of the transmitter combined with physical-based models of the transmission channel, thus no simplified behavioral models are needed. Model/hardware correlation is reported, including eye closure and jitter effects. Good mutual agreement is found between experiments and simulations.