Highly linear SOI single-pole, 4-throw switch with an integrated dual-band LNA and bypass attenuators

C. Huang, L. Lam, M. Doherty, W. Vaillancourt
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引用次数: 2

Abstract

An innovative Silicon-On-Insulator (SOI) SP4T T/R switch is presented. The SP4T switch consists of 2 receive paths with an integrated dual-band LNA and bypass attenuators along with 2 high linearity matched transmit paths. Tx paths feature 0.1 dB compression to 34 dBm input power and 0.5–0.8 dB insertion loss from 1 to 6 GHz with ≫ 20 dB return loss and ≫ 25 dB isolation. Receive paths feature 16 dB gain with 2.3 dB NF for 2.4–2.5 GHz and 14 dB gain with 2.4–2.6 dB NF for 4.9–5.9 GHz. The band selectivity exceeds 40 dB. Cascading with a dual-band WLAN PA, a complex dual-band WLAN/MIMO front-end module (FEM) can be easily constructed with low assembly complexity and post PA losses resulting in dual-band transmit linearity ≫18 dBm with EVM ≪ 3% and ≪ −50 dBm/MHz harmonic emissions within a 4 × 5 mm QFN package.
高度线性SOI单极,4投开关,集成双频LNA和旁路衰减器
提出了一种新型的绝缘体上硅(SOI) SP4T T T/R开关。SP4T开关由2个带有集成双频LNA和旁路衰减器的接收路径以及2个高线性度匹配的发射路径组成。Tx路径具有0.1 dB压缩到34 dBm输入功率和0.5-0.8 dB插入损耗,在1至6 GHz范围内具有20 dB的回波损耗和25 dB的隔离度。接收路径在2.4-2.5 GHz时具有16db增益和2.3 dB NF,在4.9-5.9 GHz时具有14db增益和2.4-2.6 dB NF。波段选择性超过40db。与双频WLAN放大器级联后,可以轻松构建复杂的双频WLAN/MIMO前端模块(FEM),其装配复杂性和后放大器损耗均较低,可实现双频传输线性度< 18 dBm,在4 × 5 mm QFN封装中,EVM≪3%和≪−50 dBm/MHz谐波发射。
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