Evaluating a Hardware-Based Approach for Detecting Resistive-Open Defects in SRAMs

F. Lavratti, L. Bolzani, F. Vargas, A. Calimera, E. Macii
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引用次数: 1

Abstract

Advances in Very Deep Sub-Micron (VDSM) technology have made possible the integration of millions of transistors into a small area and consequently, has increased the circuit's density. The increase of Nano-Scale Static Random Access Memories (SRAMs) density has become an important concern for testing, since generated new types of defects that can occur during the manufacturing process. The rapidly increasing need to store more information results in the fact that the memory elements occupy great part of the System-on-Chip's (SoC) silicon area. In this context, the present paper describes and evaluates a technique based on On-Chip Current Sensors (OCCS) and Neighbourhood Comparison Logic (NCL) to detect resistive-open defects in SRAMs. Experimental results obtained throughout simulations demonstrate the technique's efficiency as well as its behaviour considering process variation. To conclude, an analysis of the overheads makes possible the comparison with today's standard techniques.
评估一种基于硬件的sram阻性开放缺陷检测方法
甚深亚微米(VDSM)技术的进步使数百万个晶体管集成到一个小区域成为可能,从而增加了电路的密度。纳米级静态随机存储器(sram)密度的增加已成为测试中的一个重要问题,因为在制造过程中可能会产生新的缺陷。存储更多信息的需求迅速增长,导致存储元件占据了片上系统(SoC)硅面积的很大一部分。在此背景下,本文描述并评估了一种基于片上电流传感器(OCCS)和邻域比较逻辑(NCL)的技术来检测sram中的阻性打开缺陷。通过仿真得到的实验结果证明了该技术在考虑工艺变化时的有效性和性能。综上所述,对管理费用的分析使与当今标准技术的比较成为可能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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