HBM package integration: Technology trends, challenges and applications

Abstract

❯ Tb/s low latency bandwidth and lower system power is driving the need for HBM adoption ❯ Silicon Interposer (2.5D) is the incumbent technology of choice. Potentially lower cost, fine pitch interconnect wafer-level and substrate based technologies are emerging ❯ To drive broader adoption of HBM applications (cooling limited) and higher performance stacks (8-Hi), higher HBM junction temperature (>95C) needs to be supported