Advanced RF Packaging Technology Trends, from WLP and 3D Integration to 5G and Mmwave Applications

Abstract

In the last few years, radio frequency (RF) applications have driven the advanced electronics packaging market to encompass different sectors. With products such as Automotive Radar, High-End Smartphones or WiGig devices, the RF packaging market is expected to grow in every sector. Wafer-level packaging (WLP), 3D through-silicon vias (TSVs), SiPs (Systems-in-Packages), and electromagnetic interference (EMI) shielding are key enablers for heterogeneous integration in segments where RF devices require small form factors, high speed operation and a high degree of isolation. Also, cost efficiency is critical. Based on images extracted from physical analyses of several RF devices, we will demonstrate the present power of RF packaging solutions for manufacturers such as Qualcomm, Broadcom, and Skyworks, from the manufacturing cost to the functional integration. We will extract some clues for future fifth generation (5G) and millimeter wave (mmWave) applications. We will also present how these companies manage to provide highly integrated SiPs featuring several advanced packaging technologies cost-effectively. Finally, moving forward in 5G and mmWave applications, SiPs will get more complex to maintain high performance levels, with innovations like integrated EMI shielding and integrated passive devices. We will therefore introduce some key features, like advanced substrate technologies. These are also next generation technologies for 5G and mmWave systems.