Sub-threshold Performance Analysis of Multi-Layered Trapezoidal Trench Gate Silicon On Nothing MOSFET for Low Power Applications

Sikha Mishra, S. Mohanty, Guru Prasad Mishra
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Abstract

This paper presents a systematic analysis of a trapezoidal grooved stack gate Silicon on nothing (TGSG-SON) MOS structure using a TCAD simulator to decrease the short-channel effects (SCEs). An analytical model is presented here for the proposed TGSG-SON MOSFET by evaluating the 2-D Poisson's equation. Comparison has been done between SON and SOI trapezoidal trench gate MOSFETs to understand the ability of the SON structure. The influence of the corner angle and groove depth are investigated on the threshold voltage and subthreshold performance parameters. The analysis represents that TGSG-SON MOS transistor is more effective than SOI trapezoidal trench gate MOSFETs with better sub-threshold parameters and Hot carrier immunity. Further low permittivity air-filled buried layer of stack trapezoidal gate MOSFET is capable to efficiently enhance the device self heating effect (SHE).
低功耗多层梯形沟槽栅无硅MOSFET的亚阈值性能分析
本文利用TCAD模拟器系统分析了梯形槽栅栅无基硅(TGSG-SON) MOS结构,以减小其短通道效应。本文通过计算二维泊松方程,给出了TGSG-SON MOSFET的解析模型。通过对SON和SOI梯形沟槽栅极mosfet进行比较,了解SON结构的性能。研究了角和槽深对阈值电压和亚阈值性能参数的影响。分析表明,TGSG-SON MOS晶体管具有更好的亚阈值参数和热载流子抗扰性,比SOI梯形沟槽栅极mosfet更有效。进一步采用低介电常数的叠置梯形栅极MOSFET埋层充气可以有效地提高器件的自热效应。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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