R. Yamamoto, K. Ueda, H. Nagao, Tadashi Morimura, I. Eguchi, M. Kudoh, K. Kinuhata, P. Nuspl
{"title":"Fabrication of Low Power, High-Speed GaAs LSI On-Board Baseband Switching Matrix","authors":"R. Yamamoto, K. Ueda, H. Nagao, Tadashi Morimura, I. Eguchi, M. Kudoh, K. Kinuhata, P. Nuspl","doi":"10.1109/MCS.1986.1114481","DOIUrl":null,"url":null,"abstract":"A GaAs LSI On-Board Baseband Switching Matrix (BSM) for use in satellite communications for time-division multiple access (TDMA) system, has been designed and fabricated by using low dissipated Buffered-FET-Logic(BFL) with one level- shifting diode with the FET threshold voltage of about -0.5 V. For a 120 Mbit/s rate traffic signal to be used for TDMA , complete connectivity was confirmed for any possible switching pattern with a fast rise/fall time of about 1 ns at a power dissipation of 160 mW. The switch size is 16x4, expandable up to 16x16 by interbonding.","PeriodicalId":231710,"journal":{"name":"Microwave and Millimeter-Wave Monolithic Circuits","volume":"42 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1986-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microwave and Millimeter-Wave Monolithic Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCS.1986.1114481","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
A GaAs LSI On-Board Baseband Switching Matrix (BSM) for use in satellite communications for time-division multiple access (TDMA) system, has been designed and fabricated by using low dissipated Buffered-FET-Logic(BFL) with one level- shifting diode with the FET threshold voltage of about -0.5 V. For a 120 Mbit/s rate traffic signal to be used for TDMA , complete connectivity was confirmed for any possible switching pattern with a fast rise/fall time of about 1 ns at a power dissipation of 160 mW. The switch size is 16x4, expandable up to 16x16 by interbonding.