Prediction of temperature cycling life for SMT solder joints on TCE-mismatched substrates

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI:10.1109/ECTC.1990.122224

D. Riemer

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引用次数: 38

Abstract

A method for the prediction of solder-joint cycle life in surface-mount assemblies is presented. It is based on the conversion of plastic solder shear strain into cycle life with an equation derived by W. Engelmaier (1983). The shear strain is normally calculated from temperature and TCE (thermal coefficient of expansion) differentials between the package and interconnect board without consideration of elastic deformations. The suggested method derives the average plastic shear strain of the solder joint at the maximum temperature excursion from the finite-element analysis of a simple model that consists of the interconnect board, a solder joint, and the package. All materials in the model have linear (elastic) properties, except solder, which has nonlinear (elastic/plastic) characteristics. The solder joint is modeled as single finite element so that only one value is computed for the plastic shear strain in the solder joint. This value represents the average shear strain, which is converted into solder-joint cycle life. The cycle life predictions with the finite-element method are confirmed by cycling results obtained on actual hardware.<>

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tce不匹配基板上SMT焊点温度循环寿命的预测

提出了一种预测表面贴装组件焊点循环寿命的方法。它是基于用W. Engelmaier(1983)导出的公式将塑料焊料剪切应变转换为循环寿命。剪切应变通常由封装和互连板之间的温度和热膨胀系数(TCE)差来计算，而不考虑弹性变形。该方法通过对由互连板、焊点和封装组成的简单模型进行有限元分析，得出焊点在最大温度偏移时的平均塑性剪切应变。模型中的所有材料都具有线性(弹性)特性，除了焊料具有非线性(弹性/塑性)特性。将焊点建模为单个有限元，从而只计算一个焊点的塑性剪切应变值。该值表示平均剪切应变，并将其转化为焊点循环寿命。用有限元法预测的循环寿命通过在实际硬件上得到的循环结果得到了验证。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

40th Conference Proceedings on Electronic Components and Technology

CiteScore

3.10

自引率

0.00%

发文量