Modeling of chip-package resonance in power distribution networks by an impulse response

Abstract

This paper proposes a method for modeling chip-package resonance using impulse response. To extract chip and package electrical circuit parameters, we assume a circuit equivalent to the loop from the chip to the package decoupling capacitor as the RL-RC parallel circuit and convert it into an RLC parallel circuit. We apply this method to devise an electrical circuit model capable of expressing chip-package resonance with high accuracy, as confirmed by experimental results.