Nondestructive, X-Ray Inspection of Ceramic-Chip Capacitors for Delaminations

Abstract

A radiographic method has been devised and successfully applied to the detection of delaminations in small ceramic-chip capacitors. The results indicate that this nondestructive technique is suitable for sampling or 100% screening of lots. The radiograph provides an integrated image of internal structure rather than a view of just one plane as in cross sectioning. It requires proper alignment of chips in the x-ray beam, and readily detects voids of at least 0.001-inch width that extend more than 30% of the depth of the capacitor. Life tests of radiographically graded parts showed a high correlation with physical-sectioning results and with capacitor failure rates.