Electrothermal investigation on through silicon multi-walled carbon nanotube via interconnects

Abstract

This paper presents hybrid analysis of through silicon multi-walled carbon nanotube vias. A set of equivalent lumped-element circuit models for two through silicon multi-walled carbon nanotube via (TS-MWCNTV) interconnects are proposed, with quantum effect treated appropriately. The methods for characterizing all frequency- and temperature-dependent RLCG parameters of a couple of TS-MWCNTVs are then given, including their effective capacitance, effective conductance, and characteristic impedance. Further, hybrid effects of frequency, as well as temperature on the conductance of open structure is examined. Also, the time delay of the TS-MWCNTV is studied.