Fine Pitch Tab-lsi Interconnection Technology In MCM

Abstract

The quest for higher processing speed of supercomputers and mainframes has made the technology for high-density packaging extremely important. The authors have developed a new technology that permits us to connect multi-pin (487 pins) ultra-fast logic LSIs on a ceramic substrate with a fine pitch of 110 μm using TAB (Tape Automated Bonding). By developing new materials, bonding process, and manufacturing facilities, the authors were able to achieve a connection pitch finer than that which conventional technology can offer. As a result, they were able to develop an ultra-fine pitch, high-density, and high reliability packaging technology that allowed them to produce high-performance computer systems