{"title":"Recent experiences on developing multimedia educational modules","authors":"B.C. Kim","doi":"10.1109/ECTC.2000.853344","DOIUrl":null,"url":null,"abstract":"This paper describes recent experiences on developing multimedia educational modules for electronics packaging at Michigan State University (MSU). For the last two years, Michigan State University has been involved in teaching the graduate level packaging course. The course is designed to cover multi-disciplinary subjects in electronics packaging. During the course development, some multimedia modules were developed using Synch-O-Matic software tool. These lecture modules can be downloaded from the MSU Web site for individual learning and review. We have received some start-up funding from the IEEE CPMT Society and the National Science Foundation to develop more modules that are critical in electronics packaging education. These modules will be shared with other Universities and industry via the Internet Web. Some of the specific modules that we plan to develop are in the areas of Interconnect Modeling, Embedded Passives, Package Electrical Testing, and Package Layout. We plan to have a class where students can participate and learn packaging education using the Internet. The Web based lectures will contain sound, video and synchronized lecture notes on a PC. The lectures will consist of Real-Video Player with synchronized PowerPoint presentations. These lectures will be viewable over a 28.8 K modem or faster connection.","PeriodicalId":410140,"journal":{"name":"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)","volume":"58 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-05-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2000.853344","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
This paper describes recent experiences on developing multimedia educational modules for electronics packaging at Michigan State University (MSU). For the last two years, Michigan State University has been involved in teaching the graduate level packaging course. The course is designed to cover multi-disciplinary subjects in electronics packaging. During the course development, some multimedia modules were developed using Synch-O-Matic software tool. These lecture modules can be downloaded from the MSU Web site for individual learning and review. We have received some start-up funding from the IEEE CPMT Society and the National Science Foundation to develop more modules that are critical in electronics packaging education. These modules will be shared with other Universities and industry via the Internet Web. Some of the specific modules that we plan to develop are in the areas of Interconnect Modeling, Embedded Passives, Package Electrical Testing, and Package Layout. We plan to have a class where students can participate and learn packaging education using the Internet. The Web based lectures will contain sound, video and synchronized lecture notes on a PC. The lectures will consist of Real-Video Player with synchronized PowerPoint presentations. These lectures will be viewable over a 28.8 K modem or faster connection.