A high performance DC-20 GHz SPDT switch in a low cost plastic QFN package

Q. Xiao, George Samiotes, T. Galluccio, B. Rizzi
{"title":"A high performance DC-20 GHz SPDT switch in a low cost plastic QFN package","authors":"Q. Xiao, George Samiotes, T. Galluccio, B. Rizzi","doi":"10.23919/eumc.2009.5296295","DOIUrl":null,"url":null,"abstract":"This paper reviews the design and measurements of a DC-20 GHz GaAs SPDT (single-pole-double-throw) switch with state-of-the art insertion loss, isolation and power handling in a low cost plastic QFN (Quad Flatpack Non-lead) package. To reduce the performance degradation introduced by the plastic QFN package, 3D EM (electromagnetic) modelling was used to characterize the interconnection between the MMIC die and the package. The packaged switch yields 1.7 dB maximum insertion loss and 40 dB minimum isolation from DC to 20 GHz. The comparison between this result and the data measured from the MMIC bare die shows no significant performance deterioration caused by the package. The switch utilizes M/A-COM's 0.5 µm pHEMT (Pseudomorphic High Electron Mobility Transistor) process which is based on an AlGaAs/InGaAs/GaAs material system.","PeriodicalId":148226,"journal":{"name":"2009 European Microwave Integrated Circuits Conference (EuMIC)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"13","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 European Microwave Integrated Circuits Conference (EuMIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/eumc.2009.5296295","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 13

Abstract

This paper reviews the design and measurements of a DC-20 GHz GaAs SPDT (single-pole-double-throw) switch with state-of-the art insertion loss, isolation and power handling in a low cost plastic QFN (Quad Flatpack Non-lead) package. To reduce the performance degradation introduced by the plastic QFN package, 3D EM (electromagnetic) modelling was used to characterize the interconnection between the MMIC die and the package. The packaged switch yields 1.7 dB maximum insertion loss and 40 dB minimum isolation from DC to 20 GHz. The comparison between this result and the data measured from the MMIC bare die shows no significant performance deterioration caused by the package. The switch utilizes M/A-COM's 0.5 µm pHEMT (Pseudomorphic High Electron Mobility Transistor) process which is based on an AlGaAs/InGaAs/GaAs material system.
采用低成本塑料QFN封装的高性能dc - 20ghz SPDT开关
本文回顾了DC-20 GHz GaAs SPDT(单极双掷)开关的设计和测量,该开关采用低成本塑料QFN (Quad Flatpack Non-lead)封装,具有最先进的插入损耗、隔离和功率处理。为了减少塑料QFN封装带来的性能下降,使用3D EM(电磁)建模来表征MMIC芯片与封装之间的互连。封装开关最大插入损耗1.7 dB,从直流到20 GHz的隔离最小隔离40 dB。该结果与从MMIC裸模测量的数据之间的比较表明,封装没有引起显着的性能下降。该开关采用M/A-COM的0.5µM pHEMT(伪晶高电子迁移率晶体管)工艺,该工艺基于AlGaAs/InGaAs/GaAs材料系统。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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