Smart power

B. Murari
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引用次数: 190

Abstract

It is argued that thanks to the development of new power technologies, the separate paths taken by power semiconductors and small signal ICs are converging onto a single discipline: smart power. Integrating high power and high voltage devices plus control circuits on a single chip, smart power ICs bring substantial reduction in cost and enhanced reliability. Moreover, they render feasible solutions that would have been too costly when realized with conventional components. Several different technological approaches to smart power have been explored, but all such technologies share the same basic concept of merging different stcuctures on the same chip, taking advantage of the similarities in processing techniques. Smart power technologies can be classified in a number of ways, the first of which is the isolation technique used: dielectric, junction or self isolation. A further way to classify smart power processes regards the current flow in the power devices. Another fundamental distinction between smart power processes is the nature of the power elements. Two options are available: bipolar and DMOS. Smart power devices can also be divided into single-chip types and single package types.
巧实力
有人认为,由于新电源技术的发展,功率半导体和小信号集成电路所走的不同道路正在融合到一个单一的学科:智能电源。智能电源集成电路将高功率和高压器件以及控制电路集成到单个芯片上,大大降低了成本并提高了可靠性。此外,它们提供了可行的解决方案,而使用传统组件实现这些解决方案的成本过高。已经探索了几种不同的智能电源技术方法,但所有这些技术都具有相同的基本概念,即在同一芯片上合并不同的结构,利用处理技术的相似性。智能电源技术可以以多种方式分类,其中第一个是使用的隔离技术:介电、结或自隔离。对智能功率过程进行分类的另一种方法是考虑功率器件中的电流。巧实力过程之间的另一个根本区别是实力要素的性质。有两种选择:双极和DMOS。智能电源器件也可分为单芯片型和单封装型。
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