Recent development of via models: Hybrid circuit and field analysis

Abstract

Via-plate interaction can be modeled as lumped circuits for vias and a two-dimensional field problem for the plate domain. The accuracy of the improved intrinsic via model and the conventional physics-based via model is investigated by comparing them with either analytical formula or numerical simulations for a via in a circular plate pair with various edge boundary conditions. It is found that the intrinsic via model matches very well with both the analytical formula and numerical solutions in all the examples studied. However, the physics-based via model is only an acceptable approximation at low frequencies and its accuracy is not dependent on the plate size but on the via itself. It is observed that the physics-based via model is more accurate for a plate par with smaller plate separations.