Temperature compensation of MEMS resonators using sputtered Fluorine-doped silicon dioxide

Sina Moradian, S. Shahraini, R. Abdolvand
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引用次数: 1

Abstract

In this paper the linear temperature coefficient of frequency in bulk-extensional MEMS resonators is reduced utilizing a relatively thin layer of sputtered Fluorine-doped silicon dioxide (SIOF). The Fluorine doping is achieved through addition of a Fluorine-containing gas in the Ar/O2 gas mixture of a typical SiO2 RF magnetron sputtering process. Our preliminary results indicate that the temperature coefficient of elasticity (TCE) for SIOF could be significantly larger than that of pure SiO2 (1.35X larger) and that the TCE could be tuned by controlling the fluorine concentration in the SIOF film.
溅射掺氟二氧化硅的MEMS谐振器温度补偿
本文利用一层相对较薄的氟掺杂二氧化硅溅射层,降低了体外延MEMS谐振器中频率的线性温度系数。氟掺杂是通过在典型SiO2射频磁控溅射工艺的Ar/O2气体混合物中加入含氟气体来实现的。我们的初步结果表明,SIOF薄膜的温度弹性系数(TCE)可以明显大于纯SiO2薄膜的温度弹性系数(TCE)(大1.35倍),并且可以通过控制SIOF薄膜中的氟浓度来调节TCE。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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