Combining influential analysis of bonding temperature and power on bonding quality

Abstract

The bonding quality as obtained by strength tests of thermosonic bonding has been investigated as function of bonding temperature and ultrasonic power. The results show that bonding quality is very sensitive to process temperature and power. Optimum bonding temperature is not identical at different ultrasonic power. Analogously, optimum ultrasonic power which appears between 0.36W and 0.95W is not identical at different bonding temperature. The success rate of bonding is nearly 100% except for bonding temperature of 50°C and ultrasonic power of 0.035W. Meanwhile, their match is important. The combining influence of bonding temperature and power on bonding quality is analyzed by the interpolation of mean strength. The obtained data were useful for further researches.