Review on Wide Band Gap Semiconductor

Arnima Das, M. Kanjilal, M. Mukherjee, Arpita Santra
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Abstract

Wide Band Gap semiconductor materials have recently attracted the attention of the researchers for developing future energy saving society, by designing efficient switch, attenuator and power electronic devices. The large band difference of the wide band gap materials allows the designer to develop high frequency, high power, short wavelength application-based devices, which shows thermal stability in high temperature, too. Among different wide band gap materials SiC and GaN are commonly used materials for developing high quality, crack free surface of the device as their matching substrates are commonly available in the market. On the other hand, some other wide Band Gap materials like diamond, Graphene, AlN, BN, CuO, ZnO have also come in focus due to their promising functions, especially for power-device applications. In some literature review, it has been found that device characteristics obtained from these materials are quite comparable with the traditional Si based devices, and in some cases these new material shows better performance than Si. Though, some unknown defects and interface properties may be associated with these materials, which can be addressed after a thorough survey of their functions.
宽带隙半导体研究进展
近年来,宽带隙半导体材料在设计高效的开关、衰减器和电力电子器件方面受到了研究人员的关注,为未来节能社会的发展提供了新的途径。宽频带隙材料的大波段差异使设计人员能够开发高频、高功率、短波长的应用器件,这些器件在高温下也表现出热稳定性。在不同的宽带隙材料中,SiC和GaN是开发高质量、无裂纹器件表面的常用材料,它们的配套衬底在市场上是常见的。另一方面,其他一些宽带隙材料,如金刚石,石墨烯,AlN, BN, CuO, ZnO,也因其具有良好的功能而受到关注,特别是在功率器件应用中。在一些文献综述中发现,这些材料获得的器件特性与传统的Si基器件相当,在某些情况下,这些新材料的性能优于Si。然而,一些未知的缺陷和界面特性可能与这些材料有关,这可以在对其功能进行彻底调查后解决。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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