A Comparative Electro-Mechanical Characterization of Tin-Lead Solder with Equal Proportion

2020 International Conference on Computer, Electrical & Communication Engineering (ICCECE) Pub Date : 2020-01-01 DOI:10.1109/ICCECE48148.2020.9223101

F. Fazlullah, Md. Salim Kaiser, S. R. Ahmed

{"title":"A Comparative Electro-Mechanical Characterization of Tin-Lead Solder with Equal Proportion","authors":"F. Fazlullah, Md. Salim Kaiser, S. R. Ahmed","doi":"10.1109/ICCECE48148.2020.9223101","DOIUrl":null,"url":null,"abstract":"Mechanical and electrical conduction characteristics of the commonly used Sn50Pb50 solder are investigated in comparison with those of constituting pure metals. For mechanical characterization, microhardness, tensile strength, elongation, impact energy as well as photo micrographs to study the microstructure of the three material samples are analyzed. The frequency response of the material samples is investigated in terms of electrical impedance, dielectric constant as well as dielectric loss. The standard I-V characteristics is also studied to compare the DC electrical conductivity of the solder sample in comparison with the base metals. It is found that the introduction of lead to tin causes an improvement in its strength, hardness while causing a reduction in ductility and toughness. Addition of lead also improves upon the dielectric and impedance characteristics of the alloy. Increased grain boundary and grater orientational misalignment between the grains also cause a reduction in DC conductivity in Sn50Pb50 alloy.","PeriodicalId":129001,"journal":{"name":"2020 International Conference on Computer, Electrical & Communication Engineering (ICCECE)","volume":"505 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 International Conference on Computer, Electrical & Communication Engineering (ICCECE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCECE48148.2020.9223101","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

Abstract

Mechanical and electrical conduction characteristics of the commonly used Sn50Pb50 solder are investigated in comparison with those of constituting pure metals. For mechanical characterization, microhardness, tensile strength, elongation, impact energy as well as photo micrographs to study the microstructure of the three material samples are analyzed. The frequency response of the material samples is investigated in terms of electrical impedance, dielectric constant as well as dielectric loss. The standard I-V characteristics is also studied to compare the DC electrical conductivity of the solder sample in comparison with the base metals. It is found that the introduction of lead to tin causes an improvement in its strength, hardness while causing a reduction in ductility and toughness. Addition of lead also improves upon the dielectric and impedance characteristics of the alloy. Increased grain boundary and grater orientational misalignment between the grains also cause a reduction in DC conductivity in Sn50Pb50 alloy.

查看原文本刊更多论文

等比例锡铅焊料的机电特性比较

研究了常用Sn50Pb50焊料的机械和导电特性，并与构成纯金属的焊料进行了比较。对三种材料样品的显微硬度、抗拉强度、伸长率、冲击能以及显微照片进行微观结构分析。从电阻抗、介电常数和介电损耗的角度研究了材料样品的频率响应。还研究了标准I-V特性，以比较焊料样品与贱金属的直流电导率。结果表明，铅的引入使锡的强度、硬度有所提高，但延展性和韧性却有所下降。铅的加入也改善了合金的介电和阻抗特性。Sn50Pb50合金的晶界增大和晶粒间取向错位也导致了直流电导率的降低。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

2020 International Conference on Computer, Electrical & Communication Engineering (ICCECE)

自引率

0.00%

发文量