Preparation and characterization of bulk nanoporous Sn and SnO2

Mohd Lutfi Ahmad Shahar, S. Rais, M. Wahid, M. F. Ahmad
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引用次数: 1

Abstract

EUV lithography has received much attention because of leading the next generation lithography for more compact, with node size as small as 40nm integrated circuit (IC) fabrication process. Additional, the EUV lithography has been extensively researched around the world for semiconductor future road map. Bulk nanoporous of Sn and SnO2 become reliable candidate to generate EUV lithography. This paper is focused on preparation and characterization of bulk nanoporous material of Sn and SnO2 to overcome debris problem. The sample was prepared by reaction solid-state of powder Sn without organic binder and SnO2 with organic binder with compacting and sintering process. The samples are characterized by morphology identification (SEM) and phase identification (XRD). The result is proposed as prospect for future EUV lithography research to get solid low plasma density target.
块状纳米多孔锡、SnO2的制备与表征
EUV光刻技术因引领下一代光刻技术向更紧凑、节点尺寸小至40nm的集成电路(IC)制造工艺发展而备受关注。此外,EUV光刻技术已经在世界范围内被广泛研究,为半导体的未来路线图。锡和SnO2的体纳米孔成为生成EUV光刻的可靠候选材料。本文主要研究了锡、SnO2纳米多孔体材料的制备及表征,以克服碎片问题。以无有机粘结剂的锡粉和有有机粘结剂的SnO2为固体材料,采用压实烧结工艺制备样品。采用SEM和XRD对样品进行了表征。最后,对未来低等离子体密度固体靶极紫外光刻技术的研究进行了展望。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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