A Review of Failure Rate Calculation’s Differences Due to Package for IEC-TR-62380 vs. other Prediction Standards

Dan Butnicu
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引用次数: 2

Abstract

One of the major steps in the process of reliability calculation is the failure rate. It is used further for MTBF calculation which is the main reliability metric. In order to estimate failure rate, various techniques such experimental or estimation-based can be used. Over time, reliability industrial guides for the reliability prediction of electronic and electromechanical have had to provide the estimation of the above-mentioned parameter. Thus, well-known is MIL-HDBK-217F, IEC technical report TR- 62380, IEC 61709, FIDES or SN 29500-Siemens AG. Amongst them, only TR-62380 standard seems to taking account of the packaging in the reliability calculation process by mean of the particular mathematical model. In this paper, the detailed mode of calculation and comparison with the others standard methodology are reviewed.
IEC-TR-62380与其他预测标准因封装而导致故障率计算差异的综述
可靠性计算过程中的一个重要步骤是故障率的计算。将其进一步应用于主要可靠性指标MTBF的计算。为了估计故障率,可以使用各种技术,如实验或基于估计。随着时间的推移,用于电子和机电可靠性预测的可靠性工业指南不得不提供上述参数的估计。因此,众所周知的是MIL-HDBK-217F, IEC技术报告TR- 62380, IEC 61709, FIDES或SN 29500-西门子股份公司。其中,只有TR-62380标准似乎在可靠性计算过程中通过特定的数学模型考虑了包装。本文详细介绍了其计算方法,并与其他标准方法进行了比较。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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