Temperature aware thread migration in 3D architecture with stacked DRAM

Dali Zhao, H. Homayoun, A. Veidenbaum
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引用次数: 40

Abstract

A 3D architecture with DRAM memory stacked on a multi-core processor has many benefits for the embedded system. Compared with a conventional 2D design, it reduces memory access latency, increases memory bandwidth and reduces energy consumption. However it poses a thermal challenge as the heat generated by the processor cannot dissipate efficiently through the DRAM memory layer. Due to the fact that DRAM is very sensitive to high temperature as well as temperature variance, 3D stacking causes more failures to occur because DRAM thermal variance is higher than the conventional 2D architecture. To address this thermal challenge we propose to reduce temperature variance and peak temperature of a 3D multi-core processor and stacked DRAM by thermally aware thread migration among processor cores. This method has very limited impact on processor performance. Using migration-based policy we reduce peak steady-state temperature in the processor by up to 8.3 degrees Celsius, with the average of 4.7 degrees.
基于堆叠DRAM的3D架构温度感知线程迁移
将DRAM内存堆叠在多核处理器上的3D架构对嵌入式系统有许多好处。与传统的2D设计相比,它减少了存储器访问延迟,增加了存储器带宽并降低了能耗。然而,由于处理器产生的热量不能通过DRAM存储层有效地消散,因此它提出了一个热挑战。由于DRAM对高温和温度变化非常敏感,3D堆叠会导致更多的故障发生,因为DRAM的热变化高于传统的2D架构。为了解决这一热挑战,我们提出通过在处理器内核之间热感知线程迁移来减少3D多核处理器和堆叠DRAM的温度差异和峰值温度。这种方法对处理器性能的影响非常有限。使用基于迁移的策略,我们将处理器的峰值稳态温度降低了8.3摄氏度,平均降低了4.7摄氏度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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