Evaluation of Finite Element Modelling Techniques of Printed Circuit Boards under Dynamic and Static Loading and Validation with Experimental Data

Abstract

When modeling the Printed Circuit Boards (PCBs) for structural analysis, we usually trade complexity for inaccuracy due to the PCB composite nature and data unavailability. This paper presents an extensive survey of innovative Finite Element (FE) techniques for numerical modeling of the PCBs in static and dynamic conditions. We aim for an optimal FE modeling approach that captures the global effects and correct stiffness behavior. We use ANSYSTM Workbench, ANSYSTM Material Designer, and ANSYSTM Sherlock and analyze the FE model with OptiSLangTM. In addition, we model a PCB assembly as well.