Corner and Statistical SPICE Model Generation for Shielded-Gate Trench Power MOSFETs Based on Backward Propagation of Variance

Yunpeng Xiao, J. Victory, S. Pearson, T. Sarkar, A. Challa, Marc Dagan, P. Collanton, Cristian Andreev
{"title":"Corner and Statistical SPICE Model Generation for Shielded-Gate Trench Power MOSFETs Based on Backward Propagation of Variance","authors":"Yunpeng Xiao, J. Victory, S. Pearson, T. Sarkar, A. Challa, Marc Dagan, P. Collanton, Cristian Andreev","doi":"10.1109/APEC.2019.8722168","DOIUrl":null,"url":null,"abstract":"This paper proposes a novel physical approach to corner and statistical SPICE model generation for Shielded-Gate Trench Power MOSFETs. The technique is derived from the mature IC industry standard approach known as Backward Propagation of Variance. Physically based, scalable SPICE models for the device are required to implement the technique. The methodologies presented are applicable to other power discrete devices such as super-junction MOSFETs, SiC MOSFETs, GaN HEMTs, and Trench IGBTs.","PeriodicalId":142409,"journal":{"name":"2019 IEEE Applied Power Electronics Conference and Exposition (APEC)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-03-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE Applied Power Electronics Conference and Exposition (APEC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APEC.2019.8722168","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

Abstract

This paper proposes a novel physical approach to corner and statistical SPICE model generation for Shielded-Gate Trench Power MOSFETs. The technique is derived from the mature IC industry standard approach known as Backward Propagation of Variance. Physically based, scalable SPICE models for the device are required to implement the technique. The methodologies presented are applicable to other power discrete devices such as super-junction MOSFETs, SiC MOSFETs, GaN HEMTs, and Trench IGBTs.
基于方差反向传播的屏蔽栅沟道功率mosfet拐角和统计SPICE模型生成
本文提出了一种新的物理方法来生成屏蔽栅沟槽功率mosfet的拐角和统计SPICE模型。该技术源自成熟的集成电路行业标准方法,即方差的反向传播。实现该技术需要基于物理的、可扩展的设备SPICE模型。所提出的方法适用于其他功率分立器件,如超结mosfet、SiC mosfet、GaN hemt和沟槽igbt。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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