Boosting off-chip interconnects through chip-to-chip capacitive coupled communication

Abstract

We propose Chip-to-Chip Capacitive Coupled Communication (5C) to increase off-chip communication through the metal plate on the side wall of the chip packaging, as the chip to chip spacing for the state of the art electronic designs has been reduced due to the advances of design for manufacturing (DFM) technologies. We demonstrate 5C can transmit 20Gbps data on each channel and provide noise immunity to the coupling noise from adjacent channel.