Highly linear very compact untrimmed on-chip temperature sensor with second and third order temperature compensation

Jun He, Chen Zhao, S. Lee, K. Peterson, R. Geiger, Degang Chen
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引用次数: 18

Abstract

This paper proposes a CMOS structure as a highly linear on-chip temperature sensor. As long as all transistors are in saturation, the output of the structure is a VDD independent voltage source that linearly expresses CMOS threshold voltage, and hence is approximately linear in temperature. A new sizing strategy is introduced following a combined analytical and numerical optimization approach, which effectively removes both second and third order nonlinearities. Following this sizing approach, the sensor output voltage can be made very linear in temperature, with temperature INL (maximum temperature errors due to Vout temperature nonlinearity) within 0.05°C over the temperature range of −20~100°C. Results from corner simulations and Monte Carlo simulations demonstrate that the sensor linearity has excellent robustness over process variation and local device mismatches. With a standard two point calibration, the sensor's maximum output error can be confined within 0.15°C without any trimming. The sensor is very compact with a total active area around 200 µm2 when implemented in 0.18µm process.
高度线性非常紧凑的片上温度传感器,具有二阶和三阶温度补偿
本文提出一种CMOS结构作为高度线性的片上温度传感器。只要所有晶体管都处于饱和状态,该结构的输出是一个与VDD无关的电压源,线性表示CMOS阈值电压,因此温度近似线性。采用解析优化和数值优化相结合的方法,提出了一种新的尺寸调整策略,有效地消除了二阶和三阶非线性。按照这种调整尺寸的方法,传感器输出电压可以在温度上非常线性,在−20~100℃的温度范围内,温度INL(由于Vout温度非线性导致的最大温度误差)在0.05℃以内。角点仿真和蒙特卡罗仿真结果表明,传感器线性度对工艺变化和局部器件不匹配具有良好的鲁棒性。通过标准两点校准,传感器的最大输出误差可以限制在0.15°C内,无需任何修剪。该传感器非常紧凑,在0.18µm工艺中实现时,总有效面积约为200µm2。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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