Reconfigurable On-Chip SIMD Processor Architectures for Intelligent CMOS Camera Chips

D. Fey, L. Hoppe, A. Loos
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引用次数: 4

Abstract

We present results of an investigation concerning the appropriateness of different parallel SIMD architectures based on reconfigurable approaches for an integration in an one-chip high speed smart CMOS camera. The processing elements (PEs) of the architecture combine parallel analogue optical signal detection and parallel digital signal processing to meet real-time requirements. However, the parallel architecture puts some constraints on the PE architecture. To achieve reasonable pixel resolutions and fill factors the PE area has to be as low as possible. Additionally a single PE must also offer sufficient functional flexibility. We show by a logic synthesis that reconfigurable architectures based on morphological operations are the best solution to fulfill these constraints. Furthermore we present simulation results of a first test chip which we designed as an OPTO-ASIC with a simple SIMD chip architecture.
用于智能CMOS相机芯片的可重构片上SIMD处理器架构
我们提出了一项关于基于可重构方法的不同并行SIMD架构在单芯片高速智能CMOS相机集成中的适用性的调查结果。该体系结构的处理单元将并行模拟光信号检测和并行数字信号处理相结合,以满足实时性要求。然而,并行体系结构给PE体系结构带来了一些约束。为了实现合理的像素分辨率和填充因子,PE面积必须尽可能低。此外,单个PE还必须提供足够的功能灵活性。我们通过逻辑综合表明,基于形态操作的可重构架构是满足这些约束的最佳解决方案。此外,我们还给出了第一个测试芯片的仿真结果,我们将其设计为具有简单SIMD芯片架构的OPTO-ASIC。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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