A surface equivalence-based method to enable rapid design and layout iterations of coupled electromagnetic components in integrated packages

S. Chakraborty, V. Jandhyala
{"title":"A surface equivalence-based method to enable rapid design and layout iterations of coupled electromagnetic components in integrated packages","authors":"S. Chakraborty, V. Jandhyala","doi":"10.1109/EPEP.2004.1407542","DOIUrl":null,"url":null,"abstract":"A novel methodology is presented that expedites the electromagnetic analysis in the design cycle of individual layout components in close proximity to other radiating and electromagnetic structures. The proposed method retains all the advantages of a surface based moment method technique, but avoids explicit modeling of the interactions between the object under design and the neighboring ones, without compromising on the accuracy of capturing the electromagnetic coupling between them. As a result, the simulation time in an individual design cycle is greatly reduced.","PeriodicalId":143349,"journal":{"name":"Electrical Performance of Electronic Packaging - 2004","volume":"292 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electronic Packaging - 2004","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2004.1407542","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7

Abstract

A novel methodology is presented that expedites the electromagnetic analysis in the design cycle of individual layout components in close proximity to other radiating and electromagnetic structures. The proposed method retains all the advantages of a surface based moment method technique, but avoids explicit modeling of the interactions between the object under design and the neighboring ones, without compromising on the accuracy of capturing the electromagnetic coupling between them. As a result, the simulation time in an individual design cycle is greatly reduced.
一种基于表面等效的集成封装耦合电磁元件快速设计和布局迭代方法
提出了一种新的方法,加快了邻近其他辐射和电磁结构的单个布局元件在设计周期中的电磁分析。该方法保留了基于曲面矩法技术的所有优点,但避免了对设计对象与相邻对象之间相互作用的显式建模,同时又不影响捕获它们之间电磁耦合的准确性。因此,单个设计周期的仿真时间大大缩短。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信