Latent reliability degradation of ultra-thin oxides after heavy ion and /spl gamma/-ray irradiation

Bin Wang, J. Suehle, E. Vogel, J. Conley, C. Weintraub, A. Johnston, J. Bernstein
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引用次数: 7

Abstract

We studied the effects of heavy ion and /spl gamma/-ray irradiation on radiation-induced leakage current (RILC) and time-dependent dielectric breakdown (TDDB) life distributions of ultra-thin oxides (<3.5 nm). Thermal annealing experiments were carried out on irradiated devices to study the nature of RILC. TDDB experiments were also performed on irradiated devices with thermal annealing. Our results show that gamma irradiation had a minimal effect on intrinsic TDDB lifetime of ultra-thin oxides. However, heavy ion irradiation induced RILC and substantially reduced the lifetime of ultra-thin oxide films. Thermal annealing experiments suggests that RILC is due to trapped holes. Removal of RILC (and holes) do not improve TDDB lifetime.
超薄氧化物在重离子和/spl γ /射线辐照后的潜在可靠性退化
研究了重离子和/spl γ /射线辐照对超薄氧化物(<3.5 nm)辐射诱发泄漏电流(RILC)和随时间介电击穿(TDDB)寿命分布的影响。在辐照器件上进行了热退火实验,研究了RILC的性质。在辐照器件上进行了热退火实验。结果表明,γ辐照对超薄氧化物的固有TDDB寿命影响很小。然而,重离子辐照诱发了RILC,大大降低了超薄氧化膜的寿命。热退火实验表明,RILC是由困孔引起的。去除RILC(和孔)不会改善TDDB的使用寿命。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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