Methodology for an efficient characterization flow of industrial grade Si-based qubit devices

L. Contamin, B. Paz, B. Diaz, B. Bertrand, H. Niebojewski, V. Labracherie, A. Sadik, E. Catapano, M. Cassé, E. Nowak, Y. Niquet, F. Gaillard, T. Meunier, P. Mortemousque, M. Vinet
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引用次数: 1

Abstract

On-going efforts in scaling-up solid-state spin qubits are hindered by the need for a characterization workflow that assesses the correct device operation at low temperature, and for the associated quality and variability metrics. We present here our fast characterization methodology for qubit devices, and present wafer-level (WL) measurements on qubit-array structures at both 300K and 1K. Transistor-like metrics and material characterization provide feedbacks to process integration. They must be enriched by WL measurements at 1K that contain specific information about the electron confinement in a quantum dot. As such, they are crucial for process evaluation as well as device screening before continuing to mK characterization. We measure and automatically extract for the first time WL quantum dot metrics.
工业级硅基量子比特器件的有效表征流程方法
由于需要一个表征工作流程来评估低温下正确的器件操作,以及相关的质量和可变性指标,阻碍了固态自旋量子位的持续扩大。本文介绍了量子比特器件的快速表征方法,并在300K和1K下对量子比特阵列结构进行了晶圆级(WL)测量。类似晶体管的度量和材料特性为工艺集成提供反馈。它们必须通过在1K下的WL测量来富集,其中包含有关量子点中电子约束的特定信息。因此,在继续进行mK表征之前,它们对于工艺评估和设备筛选至关重要。我们首次测量并自动提取了WL量子点度量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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