{"title":"Substrate-lens coupled antennas for millimeter and submillimeter waves","authors":"D. Rutledge","doi":"10.1109/MAP.1985.27816","DOIUrl":null,"url":null,"abstract":"Antennas at millimeter and submillimeter wavelengths present formidable challenges. One approach is to scale up lower-frequency microwave systems of hollow-metal waveguides and horns. The problem with this is that as the frequency goes up, the waveguides get smaller, and the fabrication becomes difficult \nand expensive. Another way is to follow the lead of low-frequency integrated circuits and develop monolithic integrated circuits. This is attractive because there is the possibility of integrating thin-film metal antennas, solid-state devices, and low- frequency processing circuits, all on the same chip. Moreover, a large \nnumber of devices can be made together simultaneously to \nform an array or imaging system. This means we should develop antennas that work on the common integrated-circuit substrates: quartz, silicon, and gallium arsenide.","PeriodicalId":377321,"journal":{"name":"IEEE Antennas and Propagation Society Newsletter","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1985-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"17","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Antennas and Propagation Society Newsletter","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MAP.1985.27816","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 17
Abstract
Antennas at millimeter and submillimeter wavelengths present formidable challenges. One approach is to scale up lower-frequency microwave systems of hollow-metal waveguides and horns. The problem with this is that as the frequency goes up, the waveguides get smaller, and the fabrication becomes difficult
and expensive. Another way is to follow the lead of low-frequency integrated circuits and develop monolithic integrated circuits. This is attractive because there is the possibility of integrating thin-film metal antennas, solid-state devices, and low- frequency processing circuits, all on the same chip. Moreover, a large
number of devices can be made together simultaneously to
form an array or imaging system. This means we should develop antennas that work on the common integrated-circuit substrates: quartz, silicon, and gallium arsenide.