Effects of elastic modulus on the fracture behavior of low-dielectric constant films

Abstract

A model that predicts channel-crack propagation behavior in silica-based low-/spl kappa/ dielectrics (low-/spl kappa/) was developed. A solid-mechanics theory that governs fracture behavior was used to obtain low-/spl kappa/ material constants. These fracture parameters were used to predict crack behaviors in five low-/spl kappa/ films with distinct elastic moduli. The model developed demonstrates that crack propagation rate is extremely sensitive to modulus, especially when the material is compliant.