In-situ STM study of copper deposition on Cu(111) single-crystal electrode in sulfuric acid solution

Abstract

Results of an in-situ STM study of homoepitaxial copper electro deposition on Cu(111) in 0.01 M H2SO4 solution are presented which show a pronounced change in the growth and morphology of the deposit with increasing potential: while at - 0.40 V vs. SCE Cu multilayer growth is observed, Cu grows via a step-flow mechanism at -0.55 V. This behavior can be explained by the presence of an ordered sulfate adlayer at potentials >=-o.42 V, which causes a pronounced decrease in the Cu surface mobility.