A 768 k embedded DRAM for 1.244 Gb/s ATM switch in a 0.8 /spl mu/m logic process

P. Gillingham, B. Hold, I. Mes, C. O'Connell, P. Schofield, K. Skjaveland, R. Torrance, T. Wojcicki, H. Chow
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引用次数: 3

Abstract

This 256 k DRAM macrocell in a 0.8 /spl mu/m single-poly, double-metal, p-substrate, n-well logic process offers 3 times the density of an embedded SRAM without special processing steps. Robust data retention and soft-error performance are achieved by use of a p-channel 1T cell featuring a flexible high-bandwidth interface to support a variety of applications. Three macrocells are used for a 768 k queue memory in a 1.244 Gb/s ATM switch ASIC.
在0.8 /spl mu/m的逻辑过程中,用于1.244 Gb/s ATM交换机的768 k嵌入式DRAM
这款256 k的DRAM宏单元采用0.8 /spl mu/m的单聚、双金属、p衬底、n阱逻辑工艺,其密度是嵌入式SRAM的3倍,无需特殊处理步骤。通过使用具有灵活的高带宽接口以支持各种应用的p通道1T单元,实现了稳健的数据保留和软错误性能。在1.244 Gb/s的ATM交换机ASIC中,768 k队列内存使用了三个宏单元。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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