{"title":"Study on Techniques for the Increase of the Current Carrying Capability of the PCB Tracks","authors":"A. Drumea, C. Marghescu","doi":"10.1109/SIITME53254.2021.9663645","DOIUrl":null,"url":null,"abstract":"The paper investigates some techniques for the increase of the current carrying capabilities of PCB tracks – tinning and soldering of copper wires onto tracks. Such sample boards with tracks of different widths and enhancements were tested at different currents and electrical and thermal measurements were performed. The increase of the current carrying capability and thermal behavior of the PCB tracks are analyzed and some conclusions are presented.","PeriodicalId":426485,"journal":{"name":"2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"108 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SIITME53254.2021.9663645","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The paper investigates some techniques for the increase of the current carrying capabilities of PCB tracks – tinning and soldering of copper wires onto tracks. Such sample boards with tracks of different widths and enhancements were tested at different currents and electrical and thermal measurements were performed. The increase of the current carrying capability and thermal behavior of the PCB tracks are analyzed and some conclusions are presented.