Balancing performance and cost in CMOS-based thin film multichip modules

Abstract

It is pointed out that dramatic increases in the level of integration available on a single chip have led to significant changes in thinking about the role of advanced packaging in systems. In particular, multichip modules are much smaller than originally envisioned. The interconnection structure, however, has for the most part remained unchanged despite this evolution. For most applications, it is over-designed and more expensive than necessary. The way these changes have impacted on silicon-on-silicon technology, and some of the performance trade-offs of an alternative, low-cost substrate are examined. In most cases, even the low-cost alternative technology offers interconnection bandwidth beyond currently available digital chip capabilities. Optimizing for low power consumption may be a better approach for some systems.<>