Study of 130 nm SiGe HBT Periphery in the Design of 160 GHz Power Amplifier

Abdul Ali, E. Cipriani, T. Johansen, P. Colantonio
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引用次数: 8

Abstract

At mm wave, and sub-THz frequencies the foundry usually does not provide information about the power amplifying capability or optimum impedances of the transistors for maximum power, and efficiency. Therefore, in this paper, we studied and analyzed the size of a SiGe HBT (Heterojunction Bipolar Transistor) in terms of output power and efficiency performance for the design of a power amplifier (PA) operating at 160 GHz. Load pull simulations were performed for various size of transistors. Optimum size transistors resulting in high power and efficiency are used to design a 160 GHz power amplifier using the foundry models for transmission lines and MIM capacitors. The simulated power amplifier (excluding interconnects for transistors and MIM) achieves a simulated output power of 18 dBm with a power added efficiency (PAE) of 19%. Future work includes the design of low loss interconnects for transistors and MIM capacitors, and fabrication of the power amplifier.
160ghz功率放大器设计中130nm SiGe HBT外围器件的研究
在毫米波和次太赫兹频率下,铸造厂通常不提供有关功率放大能力或晶体管最大功率和效率的最佳阻抗的信息。因此,在本文中,我们研究和分析了SiGe HBT(异质结双极晶体管)在输出功率和效率性能方面的尺寸,用于设计工作在160 GHz的功率放大器(PA)。对不同尺寸的晶体管进行了负载拉拔仿真。采用传输线和MIM电容器的代工模型,设计了160ghz功率放大器,从而获得了高功率和高效率的最佳尺寸晶体管。模拟功率放大器(不包括晶体管和MIM互连)的模拟输出功率为18 dBm,功率附加效率(PAE)为19%。未来的工作包括设计晶体管和MIM电容器的低损耗互连,以及功率放大器的制造。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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