Silicon on the rack

C. Edwards
{"title":"Silicon on the rack","authors":"C. Edwards","doi":"10.1049/ESS:20060207","DOIUrl":null,"url":null,"abstract":"In the latest processes, it is normal for silicon to be stretched, strained and compressed as process engineers use ever more exotic ways of bending the silicon lattice to get more electron mobility out of transistors. This work could eventually lead to a new generation of hybrid devices that see silicon pushed out of the way altogether.","PeriodicalId":132835,"journal":{"name":"Electronic Systems and Software","volume":"118 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-10-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electronic Systems and Software","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1049/ESS:20060207","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

In the latest processes, it is normal for silicon to be stretched, strained and compressed as process engineers use ever more exotic ways of bending the silicon lattice to get more electron mobility out of transistors. This work could eventually lead to a new generation of hybrid devices that see silicon pushed out of the way altogether.
架子上的硅
在最新的工艺中,硅被拉伸、拉伸和压缩是很正常的,因为工艺工程师们使用了更奇特的方法来弯曲硅晶格,以提高晶体管的电子迁移率。这项工作最终可能会导致新一代的混合设备,看到硅完全被淘汰。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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